Wafer Polishing

Fujifilm Prescale^® Film Placed Between a Wafer Polishing Interface

Fujifilm Prescale^® is a unique, affordable and easy to use tool that reveals the distribution and magnitude of pressure in your wafer polisher.

Fujifilm Prescale^® is used to reveal pressure variation across the wafer surface. By monitoring both pressure magnitude and distribution of your wafer bonding device with Fujifilm Prescale^®, wafer surface defects can be sharply reduced.

When placed in your wafer polisher, the film instantaneously and permanently changes color in direct proportion to the actual pressure applied. Precise pressure magnitude is then easily determined by comparing the resultant color intensity to a standardized color correlation chart. No training or instrumentation is required.

Have you ever needed to evaluate pressure or force between two touching or mating surfaces? Previously, your only alternatives were strain gauges and load cells, that are both time consuming and difficult to interface. Now with the advent of our disposable one-time use pressure film, Fujifilm Prescale^®, evaluating surface contact pressure distribution and magnitude is accurate, quick and highly economical.