Pressure-sensitive System And Method Of Testing Electronic Device Interconnections

Patent Publication Number: US 6512387 B1

Title: Pressure-sensitive system and method of testing electronic device interconnections

Filing Date: July 31, 2001

Priority Date: July 31, 2001

Inventor(s): David D Bohn

Original Assignee / Applicant(s): Agilent Technologies, Inc.

Link to Patent: US6512387B1

Summary:

This invention teaches a system and method to ascertain the quality of interconnections in an electronic device. It involves placing Fujifilm Prescale®, of Sensor Products Inc., a pressure sensitive medium, at each of the interconnections. The quality of the interconnections is ascertained upon analysis of the color pattern of the corresponding pressure sensitive medium, which provides an indication of the pressure exerted by each interconnection when a force is exerted on the device. The patent also mentions “Pressurex-micro® Imaging System”, of Sensor Products Inc., in the non-patent citations.