Article: ThomasNet News
October 11, 2010 – Tactilus® lets engineers test and correct surface contact and pressure distribution between heat sink and semiconductor. In addition to visualizing contact forces and pressure distribution data on circuit board components, functionality allows for mapping, measuring, and display of changing pressure distribution between mating surfaces as mounting screws between CPU and heat sink are torqued. Heat sink interface can be tested, manipulated, and repositioned in real-time.
Sensor System helps ensure optimal heat sink efficiency.
Sensor System helps ensure optimal heat sink efficiency.